Chipbond has opened a semiconductor packaging and testing facility in Penang, extending its manufacturing footprint through a Malaysian operation. The announcement sets out the site's investment and production capabilities while leaving individual customer programmes to separate qualification and commercial arrangements.
A new site in Batu Kawan
The Edge Malaysia reported on February 9, 2026 that Chipbond Technology's new facility is located in Valdor Industrial Park, Batu Kawan. The investment was described as approximately US$200 million, or RM800 million.
Packaging and testing capabilities
The joint announcement published by MIDA identifies wafer bumping, wafer-level chip-scale packaging and testing among the site's processes. It states initial monthly capacity of 10,000 wafers and 100 million wafer-level chip-scale packaging units. The facility is also equipped to support flip-chip packaging assembly and testing.
Read the capacity measures separately
- Wafers and packaged units are different counting units, not amounts to add together.
- Published capacity is distinct from completed shipments in a particular month.
- A listed process capability does not establish approval for every customer's product.
The two capacity measures therefore describe different aspects of the site's scope. Dividing one by the other would not establish a product yield or the number of working chips produced from each wafer. That would require information about the actual product and process, not just the headline factory figures.
Enquiries about customer programmes
For a prospective customer, the relevant discussion is whether the offered process fits the product, what qualification work is needed and what schedule can be agreed. The opening announcement is a starting point for that discussion, not an individual production reservation. This account does not treat the ceremony as proof that every customer qualification has been completed.
Company: Chipbond Technology Corporation; local operation: Chipbond Technology Malaysia Sdn. Bhd. Reference customer-service email listed on the corporate contact page: CB_marketing@chipbond.com.tw. Corporate website: https://www.chipbond.com.tw/en.
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